Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices

Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices

US Patent 8860496 · Granted Oct 14, 2014

Estimated economic value: $8,705,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus having a multiplexer for passive input/output expansion2022
Selection component that is configured based on an architecture associated with 2022
Selection component that is configured based on an architecture associated with 2020
Apparatus having multiplexers for passive input/output expansion and methods of 2020
Board-to-board contactless connectors and methods for the assembly thereof2020
High-voltage and low-voltage data paths of a hybrid output driver2020
High-voltage and low-voltage signaling output driver2020
Wireless serial links for communications between devices formed in a package2020
Wireless communication link using near field coupling2019
Signal isolation structures for EM communication2019
Face down dual sided chip scale memory package2019
Face down dual sided chip scale memory package2018