Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming through-substrate interconnects

Methods of forming through-substrate interconnects

US Patent 8853072 · Granted Oct 7, 2014

Estimated economic value: $11,727,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic component guard ring2021
Microelectronic devices with through-silicon vias and associated methods of manu2021
Electronic component guard ring2019
Semiconductor constructions2018
Semiconductor constructions2018
Semiconductor constructions having through-substrate interconnects2017
Semiconductor constructions having through-substrate interconnects2017
Apparatuses and methods for die seal crack detection2017
Via chain testing structure and method2016
Microelectronic devices with through-silicon vias and associated methods of manu2016
Apparatuses and methods for die seal crack detection2016
Semiconductor module system having encapsulated through wire interconnect (TWI)2015