Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package with cap element

Semiconductor device package with cap element

US Patent 8836105 · Granted Sep 16, 2014

Estimated economic value: $3,565,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Link negotiation system, method, and device2025
Method for packaging chip2024
Li4Sr(BO3)2 compound, Li4Sr(BO3)2 nonlinear optical crystal, preparation method 2018
Semiconductor device package with cap element2015
Semiconductor device package with cap element2015
Semiconductor device package with cap element2015
Method of packaging semiconductor die with cap element2014
Method of assembling semiconductor device including insulating substrate and hea2014
Method of assembling semiconductor device including insulating substrate and hea2014
Method of assembling semiconductor device including insulating substrate and hea2014
Method of assembling semiconductor device including insulating substrate and hea2014
Method of making semiconductor package with improved standoff2013