Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells

Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells

US Patent 8779577 · Granted Jul 15, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor chip having a dense arrangement of contact terminals2018
Multi-level chip interconnect2018
Semiconductor device having a chip under package2018
Circuitry and method for monitoring a power supply of an electronic device2017
System and method for integrated circuit clock distribution2016
Overmolded substrate-chip arrangement with heat sink2016
Chip package having terminal pads of different form factors2016
Method for manufacturing a semiconductor chip with each contact pad having a pad2016
Method for manufacturing a semiconductor chip with each contact pad having a pad2016
Chip arrangement, and method for forming a chip arrangement2015
Integrated IC package2015
Method of manufacturing and testing a chip package2015