Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-reflection submount for light-emitting diode package and fabrication method thereof

High-reflection submount for light-emitting diode package and fabrication method thereof

US Patent 8778707 · Granted Jul 15, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pogo pin module and control method of pogo pin temperature2025
Systems and methods for systematic physical failure analysis (PFA) fault localiz2025
Systems and methods for systematic physical failure analysis (PFA) fault localiz2024
Systems and methods for systematic physical failure analysis (PFA) fault localiz2023
Wireless charger2023
Optoelectronic package with a low water vapor transmission rate (WVTR) and metho2020
Wafer coating system and method of manufacturing chip package2019
Optoelectronic package2019
Optoelectronic package2018
Light emitting package base structure2018
Light emitting device and method of manufacturing the same2018
Method for forming chip package2017