Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Implementing chip to chip calibration within a TSV stack

Implementing chip to chip calibration within a TSV stack

US Patent 8692561 · Granted Apr 8, 2014

Estimated economic value: $7,562,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sharable privacy-oriented personalization model2025
Event-driven platform for proactive interventions in a software application2024
Real-time error debugging2023
Real-time error debugging2023
Method and apparatus to reduce bandwidth overhead of CRC protection on a memory 2023
Method and apparatus to reduce bandwidth overhead of CRC protection on a memory 2021
System and method for providing request driven, trigger-based, machine learning 2021
Managing heterogeneous memory resource within a computing system2021
Managing heterogeneous memory resource within a computing system2021
Implementing dynamic SEU detection and correction method and circuit2021
Hardware abstraction in software or firmware for hardware calibration2021
Implementing SEU detection method and circuit2021