Method and device for packaging a substrate

Assignee

• Qualcomm

Inventors

• Lauren Palmateer (39 patents)
• William J. Cummings (110 patents)
• Brian J. Gally (94 patents)
• Mark W. Miles (122 patents)
• Jeffrey B. Sampsell (148 patents)
• Clarence Chui (220 patents)
• Manish Kothari (141 patents)

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