Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor chip with through-silicon-via and sidewall pad

Semiconductor chip with through-silicon-via and sidewall pad

US Patent 8674482 · Granted Mar 18, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Button cell and preparation method thereof2025
Device for supplementing electrode plate with lithium and method for supplementi2025
Mobile phone2025
Mobile phone2025
Method for manufacturing a humidity alarm device based on laser-induced graphene2025
Global data line of multi-array synchronous random access memory (SRAM)2025
Button cell and electronic device2025
Mobile phone2025
Lithiation device2025
Negative electrode plate, lithium-ion battery and apparatus2025
Route discovery method and apparatus, device, and storage medium2025
Device for supplementing electrode sheet with lithium and method for supplementi2025