Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method

Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method

US Patent 8664778 · Granted Mar 4, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of producing a hybridized device including microelectronic components2018
Method of manufacturing a plurality of island-shaped dipoles having self-aligned2018
Hybrid electronic device protected against humidity and method of protecting a h2017
Flip-chip assembly process comprising pre-coating interconnect elements2016
Assembly method, of the flip-chip type, for connecting two electronic components2016
Connecting elements for producing hybrid electronic circuits2015
Method of making a connection component with hollow inserts2014
Detector system with an optical function and method for making such a system2014
Nanoprinted device comprising metallic patterns and method of nanoprinting metal2012
Method for bonding two electronic components2012
Metal lip seal and machine fitted with same seal2012
Method of thinning a block transferred to a substrate2012