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Home › Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

US Patent 8659146 · Granted Feb 25, 2014

Estimated economic value: $6,591,000 ⓘ

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