Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8659146 | Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing | Robert Bauer | 2014-02-25 |
| 8456023 | Semiconductor wafer processing | Robert Bauer | 2013-06-04 |
| 8283762 | Lead frame based semiconductor package and a method of manufacturing the same | Robert Bauer | 2012-10-09 |
| 8004069 | Lead frame based semiconductor package and a method of manufacturing the same | Robert Bauer | 2011-08-23 |
| 7772036 | Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing | Robert Bauer | 2010-08-10 |