Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip electronic package with reduced stress

Multi-chip electronic package with reduced stress

US Patent 8604595 · Granted Dec 10, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical liquid providing unit and substrate treating apparatus including the sa2025
Unit for storing liquid and apparatus for treating substrate2025
Method of packaging a die2014
Semiconductor device and method of packaging a semiconductor device with a clip2014
Method of packaging a die2013
Semiconductor device and method of packaging a semiconductor device with a clip2013
Die package2013
Fabrication of an integrated circuit package2012
Electronic component and method for its production2011
Electronic component and method for its production2011
Semiconductor device and method of assembly2011
Integrated circuit device and a method of making the integrated circuit device2011