Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Liquid-cooling memory modules with liquid flow pipes between memory module sockets

Liquid-cooling memory modules with liquid flow pipes between memory module sockets

US Patent 8587943 · Granted Nov 19, 2013

Estimated economic value: $3,686,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cooling systems having a conduit and a heat transfer device for transferring hea2025
Cooling systems having cooling and augmentation loops for electronic components 2025
Overcooling an edge device that uses electrical energy from a local renewable en2024
Relative thermal efficiency values for controlling operation of adapter modules2024
Optimizing waste heat recovery and return water temperature using dynamic flow c2024
Optimizing waste heat recovery and return water temperature using dynamic flow c2024
Hybrid single-phase/two-phase cooling loop to enhance cooling of components2023
Thermoelectric cooler systems for thermal enhancement in immersion cooling and a2023
Liquid cooled memory module service device for systems with multiple memory modu2022
Systems and methods for controlling air distribution to electronic components2021
Systems having fluid conduit carriers for holding different portions of a fluid 2021
Systems having fluid conduit carriers for holding different portions of a fluid 2021