Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing

Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing

US Patent 8587135 · Granted Nov 19, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ink for ink-jet printer of charge control type2025
Semiconductor device2017
Semiconductor device2016
Bonding wire to bonding pad2016
Semiconductor device, method of manufacturing the device, and liquid crystal dis2015
Method of manufacturing semiconductor device2015
Vehicle body structure2014
Semiconductor device and a manufacturing method of the same2013
Method of manufacturing semiconductor device2012
Method of manufacturing semiconductor device2012
Method of manufacturing semiconductor device2012
Semiconductor device and a manufacturing method of the same2011