Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293436 | Bonding wire to bonding pad | Toshihiko Akiba, Yuki Yagyu | 2016-03-22 |
| 8587135 | Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing | Tamaki Wada, Seiichi Ichihara | 2013-11-19 |
| 8338288 | Method of manufacturing semiconductor device | Tamaki Wada, Seiichi Ichihara | 2012-12-25 |
| 7784267 | Detonation engine and flying object provided therewith | Toshitaka Fujiwara, Piotr Wolanski | 2010-08-31 |