Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for establishing and closing a trench of a semiconductor component

Method for establishing and closing a trench of a semiconductor component

US Patent 8587095 · Granted Nov 19, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micromechanical component for a rotation rate sensor2025
Micromechanical component for a sound transducer and corresponding production me2025
Micromechanical sensor structure with damping structure2025
Sensor device for measuring a temperature difference in a computer chip system2025
Micromechanical component for a sensor device2025
Method for manufacturing a MEMS switch having an embedded metal contact2025
MEMS relay2025
Micromechanical component for a pressure and inertial sensor device2024
Device for detecting sound in the surroundings of an automobile2024
Micromechanical sensor device and corresponding production method2024
Capacitively operable MEMS switch2024
Method for manufacturing a microelectromechanical structure and microelectromech2024