Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Material structure in scribe line and method of separating chips

Material structure in scribe line and method of separating chips

US Patent 8531008 · Granted Sep 10, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Turn-bolt device for a transporting star wheel2025
Method and apparatus for use in wafer processing2024
Package having an electronic component and an encapsulant encapsulating a dielec2024
Method for allocating operating parameters to local control units intended to co2024
Measurement setup, reference reflector as well as method for measuring attenuati2024
Device holder2023
Apparatus for attaching a dental component to a dental implant2023
Measurement illumination optical unit for guiding illumination light into an obj2023
Method and apparatus for use in wafer processing2023
Electronic component with semiconductor die having a low ohmic portion with an a2023
Processing of solid micron sized particles for rapid deposition on substrate sur2022
Organic haptic interface2021