Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer backside defectivity clean-up utilizing selective removal of substrate material

Wafer backside defectivity clean-up utilizing selective removal of substrate material

US Patent 8486814 · Granted Jul 16, 2013

Estimated economic value: $5,283,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micro-machined filter for magnetic particles2025
Three-dimensional silicon-based comb probe with optimized biocompatible dimensio2024
Nanostructure featuring nano-topography with optimized electrical and biochemica2024
Medical device for stimulating and sensing bioactivity2023
Micro-machined filter for magnetic particles2023
Nanostructure featuring nano-topography with optimized electrical and biochemica2023
Three-dimensional silicon-based comb probe2022
Neuro-chemical sensor with inhibition of fouling on nano-electrode2022
Intelligent and disposable device for selective electrical stimulation of apopto2022
Intelligent and disposable device for selective electrical stimulation of apopto2022
Methods and systems for processing language with standardization of source data2021
Saccade and vergence tracking for distance auto focus adjustment2021