Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for fabricating sensor device package using a sealing structure

Methods for fabricating sensor device package using a sealing structure

US Patent 8476087 · Granted Jul 2, 2013

Estimated economic value: $4,243,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with attached battery and method therefor2025
Semiconductor device with embedded battery and method therefor2025
Patterned and planarized under-bump metallization2024
Stress isolated device package and method of manufacture2024
Semiconductor device package having stress isolation and method therefor2023
No-gel pressure sensor package2023
Transporting light within circuit board profile2023
No-gel pressure sensor package2022
Shielded electronic package and method of fabrication2022
Method, system, and apparatus for forming three-dimensional semiconductor device2022
Grounding lids in integrated circuit devices2021
Grounding lids in integrated circuit devices2021