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Home › In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit

In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit

US Patent 8461588 · Granted Jun 11, 2013

Estimated economic value: $15,668,000 ⓘ

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