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Home › In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit

In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit

US Patent 7648847 · Granted Jan 19, 2010

Estimated economic value: $36,365,000 ⓘ

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