Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heater chips with silicon die bonded on silicon substrate, including offset wire bonding

Heater chips with silicon die bonded on silicon substrate, including offset wire bonding

US Patent 8459779 · Granted Jun 11, 2013

Estimated economic value: $9,790,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Physical unclonable function (PUF) alters disk structure to encode region2022
Physical unclonable functions in bank cards or identification cards for security2020
Embedded extensible instrumentation bus2019
Maintenance valve for fluid ejection head2018
Maintenance valve for fluid ejection head2018
Laminate constructs for micro-fluid ejection devices2017
Maintenance valve for fluid ejection head2017
Maintenance valve for fluid ejection head2017
Laminate constructs for micro-fluid ejection devices2015
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and2015
Planar heater stack and method for making planar heater stack with cavity within2014
Modular micro-fluid ejection head assembly2014