Issued Patents All Time
Showing 1–25 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10291415 | Embedded extensible instrumentation bus | Bernd Heppner | 2019-05-14 |
| 9707758 | Laminate constructs for micro-fluid ejection devices | Richard Corley, Michael John Dixon, Jiandong Fang, Jeanne Marie Saldanha Singh | 2017-07-18 |
| 9144969 | Laminate constructs for micro-fluid ejection devices | Richard Corley, Michael John Dixon, Jiandong Fang, Jeanne Marie Saldanha Singh | 2015-09-29 |
| 8777376 | Skewed nozzle arrays on ejection chips for micro-fluid applications | Richard Corley, Jiandong Fang | 2014-07-15 |
| 8727500 | Heater chips with silicon die bonded on silicon substrate, including offset wire bonding | Burton Lee Joyner, II, Timothy Strunk, Carl Edmond Sullivan | 2014-05-20 |
| 8657411 | Fluid ejection device and method for fabricating fluid ejection device | Jiandong Fang | 2014-02-25 |
| 8642249 | Micro-fluid ejection devices with a polymeric layer having an embedded conductive material | Yimin Guan, Carl Edmond Sullivan, Timothy Strunk | 2014-02-04 |
| 8636340 | Printheads and method for assembling printheads | Michael John Dixon, Jiandong Fang, Richard Corley, Jeanne Marie Saldanha Singh, Xiaoming Wu | 2014-01-28 |
| 8622524 | Laminate constructs for micro-fluid ejection devices | Richard Corley, Michael John Dixon, Jiandong Fang, Jeanne Marie Saldanha Singh | 2014-01-07 |
| 8500242 | Micro-fluid ejection head | Jiandong Fang, Jeanne Marie Saldanha Singh, Mike Dixon, Bryan Dale McKinley, Samuel Sexton | 2013-08-06 |
| 8459779 | Heater chips with silicon die bonded on silicon substrate, including offset wire bonding | Burton Lee Joyner, II, Carl Edmond Sullivan, Timothy Strunk | 2013-06-11 |
| 8414114 | Systems for priming fluid jetting devices | Jiandong Fang, Audrey Rodgers, Timothy Strunk, James Harold Powers | 2013-04-09 |
| 8393712 | Chevron ejection chips for micro-fluid applications | Jiandong Fang, Richard Corley | 2013-03-12 |
| 8373951 | Universal serial bus protection circuit | David John Vetter | 2013-02-12 |
| 8366952 | Low ejection energy micro-fluid ejection heads | Byron V. Bell, Robert W. Cornell, Yimin Guan | 2013-02-05 |
| 8313167 | Tiled manifold for a page wide printhead | Richard Corley, Michael John Dixon | 2012-11-20 |
| 8210660 | High volume ink delivery manifold for a page wide printhead | James Harold Powers | 2012-07-03 |
| 8087756 | Heater chips with silicon die bonded on silicon substrate | David L. Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew McNees, Timothy Strunk +1 more | 2012-01-03 |
| 8061811 | Micro-fluid ejection heads with chips in pockets | Jeanne Marie Saldanha Singh, Carl Edmond Sullivan, Sean Terrence Weaver | 2011-11-22 |
| 8038365 | Apparatus and method for improving the control of a concrete screed head assembly | Philip J. Quenzi, Carl B. Kieranen, Jeffrey Torvinen, Mark A. Pietela | 2011-10-18 |
| 8029100 | Micro-fluid ejection heads with chips in pockets | Jeanne Marie Saldanha Singh, Carl Edmond Sullivan, Sean Terrence Weaver | 2011-10-04 |
| 7959261 | Micro-fluid ejection devices having reduced input/output addressable heaters | Michael John Dixon, Jeanne Marie Saldanha Singh, Timothy Strunk, George Nelson Woolcott | 2011-06-14 |
| 7938513 | Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips | David L. Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew McNees, Timothy Strunk +1 more | 2011-05-10 |
| 7938508 | Low profile printhead | Curtis Ray Droege, Sam Norasak | 2011-05-10 |
| 7937835 | Composite ceramic substrate for micro-fluid ejection head | Michael John Dixon, Eric Spencer Hall, Elios Klemo, Bryan Dale McKinley, Jeanne Marie Saldanha Singh | 2011-05-10 |