Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11938477 | Microfluidic cartridge comprising silicone pressure-sensitive adhesive | Chisomaga Ugochi NWACHUKWU, Judith Ann Hollingshead, David C. Graham, Sean Terrence Weaver | 2024-03-26 |
| 11433681 | Sealing tape for organic solvent-based fluidic cartridges | Jacob Boyle, David C. Graham, Sean T. Weaver | 2022-09-06 |
| 10987935 | Organic solvent sealing tape | David C. Graham, Sean T. Weaver | 2021-04-27 |
| 10814638 | Fluidic ejection cartridge for improved protective tape removal | David E. Larose | 2020-10-27 |
| 10384458 | Fluidic ejection cartridge for improved protective tape removal | James D. Anderson, Jr., Jason Vanderpool | 2019-08-20 |
| 9844940 | Printhead cartridge with hydrophobic coating | Christopher A. Craft | 2017-12-19 |
| 9630416 | Printhead cartridge with hydrophobic coating | Christopher A. Craft | 2017-04-25 |
| 9365044 | Printhead cartridge with hydrophobic coating | Christopher A. Craft | 2016-06-14 |
| 9132654 | Label for inkjet printhead | Jason Vanderpool, Richard L. Warner, David L. Bernard, Andrew McNees | 2015-09-15 |
| 8956450 | Formulation for silicon-doped ink used to prevent chip etching | Yimin Guan, Eunki Hong, Christopher Money, Jose Paul Sacoto Aguilar | 2015-02-17 |
| 8882221 | Modular micro-fluid ejection head assembly | David L. Bernard, David Golman King, Andrew McNees, Timothy Strunk | 2014-11-11 |
| 8826502 | Method for making a substantially planar micro-fluid ejection head | David L. Bernard, Andrew McNees | 2014-09-09 |
| 8785524 | Spray coatable adhesive for bonding silicon dies to rigid substrates | Xiaoming Wu, David Rhine, Anna Marie Pearson, Jeanne Marie Saldanha Singh, Richard D. Wells +1 more | 2014-07-22 |
| 8728715 | Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plate | David L. Bernard, Bart Mansdorf, Xiaoming Wu | 2014-05-20 |
| 8491095 | Fluid ejection device and method for fabricating fluid ejection device | Andrew McNees, David L. Bernard, Sean T. Weaver, Eric S. Hall | 2013-07-23 |
| 8324076 | Micro-fluid ejection heads and methods for bonding substrates to supports | David L. Bernard, Andrew McNees | 2012-12-04 |
| 8087756 | Heater chips with silicon die bonded on silicon substrate | Frank Edward Anderson, David L. Bernard, Burton Lee Joyner, II, Andrew McNees, Timothy Strunk +1 more | 2012-01-03 |
| 8071275 | Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods | David L. Bernard, Andrew McNees | 2011-12-06 |
| 7938513 | Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips | Frank Edward Anderson, David L. Bernard, Burton Lee Joyner, II, Andrew McNees, Timothy Strunk +1 more | 2011-05-10 |
| 7815289 | Micro-fluid ejection heads and methods for bonding substrates to supports | David L. Bernard, Andrew McNees | 2010-10-19 |
| 7735952 | Method of bonding a micro-fluid ejection head to a support substrate | David L. Bernard, Andrew McNees | 2010-06-15 |
| 7531047 | Method of removing residue from a substrate after a DRIE process | James Mrvos, David Rhine | 2009-05-12 |
| 6641675 | Method and apparatus for immersion treatment of semiconductor and other devices | Richard Scott Tirendi, James Bradley Sundin | 2003-11-04 |
| 6415803 | Method and apparatus for semiconductor wafer cleaning with reuse of chemicals | James Bradley Sundin, Richard Scott Tirendi | 2002-07-09 |
| 6284055 | Method and apparatus for immersion treatment of semiconductor and other devices | Richard Scott Tirendi, James Bradley Sundin | 2001-09-04 |