Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder layer and electronic device bonding substrate and submount using the same

Solder layer and electronic device bonding substrate and submount using the same

US Patent 8404359 · Granted Mar 26, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of producing reflective electrode for deep ultraviolet light-emitting ele2025
Substrate working system and method for conveying component in substrate working2024
Solar battery unit and wireless transmitter including solar battery unit2023
Data transmitter with solar cell and sensor2021
Communication module with solar cell2021
System, method, and program for managing evaluation of avatar images2020
Inkjet printing apparatus2020
Base station antenna apparatus for mobile communication system2018
Printed material, method of producing printed material, and printer2017
Transmitting-receiving-separated dual-polarization antenna2016
Semiconductor light emitting diode and method of producing the same2016
Printed material, method of producing printed material, and printer2016