Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of dicing stacked shingled strip constructions to form stacked die packages

Methods of dicing stacked shingled strip constructions to form stacked die packages

US Patent 8399974 · Granted Mar 19, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Materials and methods for stress reduction in semiconductor wafer passivation la2014
Materials and methods for stress reduction in semiconductor wafer passivation la2013
Electronic packaging materials for use with low-k dielectric-containing semicond2009
Interlayer dielectric and pre-applied die attach adhesive materials2009
Interlayer dielectric and pre-applied die attach adhesive materials2007
Additive processing electroless metal plating using aqueous photoresist1986
Selective metal etch technique1983