{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Doping of lead-free solder alloys and structures formed thereby", "item": "https://www.patentleaderboard.com/patent/8395051"}]}
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Home › Doping of lead-free solder alloys and structures formed thereby

Doping of lead-free solder alloys and structures formed thereby

US Patent 8395051 · Granted Mar 12, 2013

Estimated economic value: $18,179,000 ⓘ

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