Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bondwireless power module with three-dimensional current routing

Bondwireless power module with three-dimensional current routing

US Patent 8350376 · Granted Jan 8, 2013

Estimated economic value: $3,275,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer scale package for high power devices2017
Mechatronic integration of motor drive and E-machine, especially smart-E-motor2015
Dual compartment semiconductor package2015
Power module with press-fit clamps2015
Stacked half-bridge power module2015
Semiconductor package having internal shunt and solder stop dimples2015
Semiconductor package with temperature sensor2014
Semiconductor package for high power devices2014
Power semiconductor package with double-sided cooling2014
Power module with current routing2014
Power module with current routing2014
Bond wireless power module with double-sided single device cooling and immersion2014