Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559068 | Wafer scale package for high power devices | — | 2017-01-31 |
| 9102242 | Mechatronic integration of motor drive and E-machine, especially smart-E-motor | — | 2015-08-11 |
| 9054119 | Dual compartment semiconductor package | — | 2015-06-09 |
| 9001518 | Power module with press-fit clamps | — | 2015-04-07 |
| 8987777 | Stacked half-bridge power module | — | 2015-03-24 |
| 8928115 | Semiconductor package having internal shunt and solder stop dimples | — | 2015-01-06 |
| 8860198 | Semiconductor package with temperature sensor | — | 2014-10-14 |
| 8836112 | Semiconductor package for high power devices | — | 2014-09-16 |
| 8804340 | Power semiconductor package with double-sided cooling | — | 2014-08-12 |
| 8736040 | Power module with current routing | Andrea Gorgerino | 2014-05-27 |
| 8680666 | Bond wireless power module with double-sided single device cooling and immersion bath cooling | — | 2014-03-25 |
| 8637981 | Dual compartment semiconductor package with temperature sensor | — | 2014-01-28 |
| 8604611 | Semiconductor device assembly utilizing a DBC substrate | — | 2013-12-10 |
| 8569883 | Package for high power devices | — | 2013-10-29 |
| 8368210 | Wafer scale package for high power devices | — | 2013-02-05 |
| 8350376 | Bondwireless power module with three-dimensional current routing | Andrea Gorgerino | 2013-01-08 |
| 8102668 | Semiconductor device package with internal device protection | Alana Nakata | 2012-01-24 |
| 8018056 | Package for high power density devices | — | 2011-09-13 |
| 7956566 | Driver IC with HV-isolation, especially hybrid electric vehicle motor drive concept | — | 2011-06-07 |
| 7834575 | Gate-driver IC with HV-isolation, especially hybrid electric vehicle motor drive concept | — | 2010-11-16 |
| 7723830 | Substrate and method for mounting silicon device | — | 2010-05-25 |
| 7619302 | Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules | — | 2009-11-17 |
| 7573727 | Connecting device for contacting a semiconductor component | Dirk Balszunat | 2009-08-11 |
| 7567053 | Mechatronic integration of motor drive and E-machine, especially smart-E-motor | — | 2009-07-28 |
| 7554188 | Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes | — | 2009-06-30 |