Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for making contact with and housing integrated circuits

Process for making contact with and housing integrated circuits

US Patent 8349707 · Granted Jan 8, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for producing a structured coating on a substrate, coated substrate, and 2021
Method for manufacturing an arrangement with a component on a carrier substrate 2015
Method for making via interconnection2014
Method for producing a dielectric layer in an electroacoustic component, and ele2014
Glass material for radio-frequency applications2012
Method for producing electronic components2012
Process for making contact with and housing integrated circuits2011
Process for making contact with and housing integrated circuits2011
Process of vapor depositing glass layers for wafer-level hermetic encapsulation 2011
Method for the production of structured layers on substrates2010
Process for making contact with and housing integrated circuits2010
Method for producing a component comprising a conductor structure that is suitab2010