Electromechanical devices having support structures

Assignee

• Qualcomm

Inventors

• Jeffrey B. Sampsell (148 patents)
• Clarence Chui (220 patents)
• Manish Kothari (141 patents)
• Mark W. Miles (122 patents)
• Teruo Sasagawa (44 patents)
• Wonsuk Chung (35 patents)
• Ming-Hau Tung (62 patents)

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