Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming a metal pattern and semiconductor device structure

Methods of forming a metal pattern and semiconductor device structure

US Patent 8329580 · Granted Dec 11, 2012

Estimated economic value: $3,231,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die features for self-alignment during die bonding2022
Devices with three-dimensional structures and support elements to increase adhes2022
Edge cut debond using a temporary filler material with no adhesive properties an2021
Reduction of roughness on a sidewall of an opening2021
Semiconductor devices having discretely located passivation material, and associ2021
Methods of fabricating conductive traces and resulting structures2020
Methods for enhancing adhesion of three-dimensional structures to substrates2020
Die features for self-alignment during die bonding2020
Edge cut debond using a temporary filler material with no adhesive properties an2019
Methods of fabricating conductive traces and resulting structures2019
Semiconductor devices having discretely located passivation material, and associ2019
Semiconductor devices having discretely located passivation material, and associ2018