Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Print head having a polymer layer to facilitate assembly of the print head

Print head having a polymer layer to facilitate assembly of the print head

US Patent 8303093 · Granted Nov 6, 2012

Estimated economic value: $1,133,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conductive structure interconnects with downward projections2025
Semiconductor device and method for manufacturing the same2025
Semiconductor device with conductive liners over silicide structures and method 2025
Semiconductor device with tunable threshold voltage and method for manufacturing2025
Method for forming a contact plug by bottom-up metal growth2025
Semiconductor arrangement and method for making2025
Semiconductor device structure with inner spacer layer2025
Air inner spacers2025
Contact structure for semiconductor device2025
Isolation structures of semiconductor devices2025
Method of fabricating a semiconductor structure and semiconductor structure obta2025
Inner spacer formation in multi-gate transistors2025