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Home › Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

US Patent 8283783 · Granted Oct 9, 2012

Estimated economic value: $829,000 ⓘ

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