Three-dimensional SoC structure formed by stacking multiple chip modules

Assignee

• National Chip Implementation Center National Applied Research Laboratories

Inventors

• Chun-Ming Huang (79 patents)
• Chin-Long Wey (7 patents)
• Chien-Ming Wu (61 patents)
• Chih-Chyau Yang (6 patents)
• Shih-Lun Chen (19 patents)
• Chi-Shi Chen (3 patents)
• Chi-Sheng Lin (14 patents)

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