Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8399303 | Method for manufacturing modularized integrated circuit | Chun-Ming Huang, Chi-Sheng Lin, Chien-Ming Wu | 2013-03-19 |
| 8274794 | Three-dimensional SoC structure formed by stacking multiple chip modules | Chun-Ming Huang, Chin-Long Wey, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen +1 more | 2012-09-25 |
| 8199510 | Multi-layer SoC module structure | Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey +1 more | 2012-06-12 |