Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating

Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating

US Patent 8226804 · Granted Jul 24, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for electrochemical dewatering of suspensions of cellulosic2024
Electrochemical mirror system and method2020
Apparatus for recovery of material generated during electrochemical material rem2019
Electrochemical system and method for electropolishing hollow metal bodies2018
Apparatus and method for recovery of material generated during electrochemical m2018
Electrolytic system and method for filtering an aqueous particulate suspension2017
Method and apparatus for pulsed electrochemical grinding2016
Electrolytic system and method for filtering an aqueous particulate suspension2015
Electrochemical system and method for electropolishing superconductive radio fre2015
Tin and tin alloy electroplating method with controlled internal stress and grai2013
Electroplating cell with hydrodynamics facilitating more uniform deposition acro2012
Electroplating cell with hydrodynamics facilitating more uniform deposition acro2012