Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091333 | Method and apparatus for electrochemical dewatering of suspensions of cellulosic nanomaterials | Timothy D. Hall, Maria E. Inman, Stephen T. Synder, Santosh H. Vijapur, Thi Xuan Huong Le | 2024-09-17 |
| 10684522 | Electrochemical mirror system and method | Holly M. Garich, Maria E. Inman | 2020-06-16 |
| 10214832 | Apparatus for recovery of material generated during electrochemical material removal in acidic electrolytes | Maria E. Inman, Brian T. Skinn, Timothy D. Hall, Stephen T. Snyder, Savidra C. Lucatero +1 more | 2019-02-26 |
| 9987699 | Electrochemical system and method for electropolishing hollow metal bodies | Maria E. Inman, Timothy D. Hall | 2018-06-05 |
| 9938632 | Apparatus and method for recovery of material generated during electrochemical material removal in acidic electrolytes | Maria E. Inman, Brian T. Skinn, Timothy D. Hall, Stephen T. Snyder, Savidra C. Lucatero +1 more | 2018-04-10 |
| 9546101 | Electrolytic system and method for filtering an aqueous particulate suspension | Maria E. Inman, Joseph Kell, Heather McCrabb, Anthony Ferrante, Ross O. Youngs +2 more | 2017-01-17 |
| 9403228 | Method and apparatus for pulsed electrochemical grinding | Maria E. Inman | 2016-08-02 |
| 9095808 | Electrolytic system and method for filtering an aqueous particulate suspension | Maria I. Inman, Joseph Kell, Heather McCrabb, Anthony Ferrante, Ross O. Youngs +2 more | 2015-08-04 |
| 9006147 | Electrochemical system and method for electropolishing superconductive radio frequency cavities | Maria E. Inman, Timothy D. Hall | 2015-04-14 |
| 8603315 | Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit | Jenny J. Sun | 2013-12-10 |
| 8329006 | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller | 2012-12-11 |
| 8226804 | Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating | Lawrence E. Gebhart | 2012-07-24 |
| 7947161 | Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes | Lawrence E. Gebhart | 2011-05-24 |
| 7553401 | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller | 2009-06-30 |
| 7022216 | Electrolytic etching of metal layers | Heather Dyar | 2006-04-04 |
| 6878259 | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates | Chengdong Zhou, Jenny J. Sun | 2005-04-12 |
| 6863793 | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes | Jenny J. Sun, Maria E. Inman | 2005-03-08 |
| 6827833 | Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields | Jenny J. Sun | 2004-12-07 |
| 6750144 | Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes | — | 2004-06-15 |
| 6652727 | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes | Jenny J. Sun, Maria E. Inman | 2003-11-25 |
| 6558231 | Sequential electromachining and electropolishing of metals and the like using modulated electric fields | — | 2003-05-06 |
| 6551485 | Electrodeposition of metals for forming three-dimensional microstructures | — | 2003-04-22 |
| 6524461 | Electrodeposition of metals in small recesses using modulated electric fields | Jenny J. Sun, Chengdong Zhou | 2003-02-25 |
| 6402931 | Electrochemical machining using modulated reverse electric fields | Chengdong Zhou, Jenny J. Sun, Lawrence E. Gebhart, Robert P. Renz | 2002-06-11 |
| 6319384 | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates | Chengdong Zhou, Jenny J. Sun | 2001-11-20 |