Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8603315 | Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit | E. Jennings Taylor | 2013-12-10 |
| 8329006 | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | Lawrence E. Gebhart, Phillip O. Miller, E. Jennings Taylor | 2012-12-11 |
| 7553401 | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | Lawrence E. Gebhart, Phillip O. Miller, E. Jennings Taylor | 2009-06-30 |
| 6878259 | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates | E. Jennings Taylor, Chengdong Zhou | 2005-04-12 |
| 6863793 | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes | E. Jennings Taylor, Maria E. Inman | 2005-03-08 |
| 6827833 | Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields | E. Jennings Taylor | 2004-12-07 |
| 6652727 | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes | E. Jennings Taylor, Maria E. Inman | 2003-11-25 |
| 6524461 | Electrodeposition of metals in small recesses using modulated electric fields | E. Jennings Taylor, Chengdong Zhou | 2003-02-25 |
| 6402931 | Electrochemical machining using modulated reverse electric fields | Chengdong Zhou, E. Jennings Taylor, Lawrence E. Gebhart, Robert P. Renz | 2002-06-11 |
| 6319384 | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates | E. Jennings Taylor, Chengdong Zhou | 2001-11-20 |
| 6309528 | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes | E. Jennings Taylor, Maria E. Inman | 2001-10-30 |
| 6303014 | Electrodeposition of metals in small recesses using modulated electric fields | E. Jennings Taylor, Chengdong Zhou | 2001-10-16 |
| 6210555 | Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating | E. Jennings Taylor, Chengdong Zhou | 2001-04-03 |
| 6203684 | Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates | E. Jennings Taylor, Chengdong Zhou | 2001-03-20 |
| 5804057 | Method of removing metal salts from solution by electrolysis an electrode closely associated with an ion exchange resin | Chengdong Zhou, E. Jennings Taylor, Robert P. Renz, Eric C. Stortz | 1998-09-08 |