Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Crack free multilayered devices, methods of manufacture thereof and articles comprising the same

Crack free multilayered devices, methods of manufacture thereof and articles comprising the same

US Patent 8222057 · Granted Jul 17, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of decontamination of process chamber after in-situ chamber clean2018
Coalesced nanowire structures with interstitial voids and method for manufacturi2017
Tungsten nitrido precursors for the CVD of tungsten nitride, carbonitride, and o2017
Nanopyramid sized opto-electronic structure and method for manufacturing of same2016
Method of forming a group III-nitride crystalline film on a patterned substrate 2016
Formation of group III-V material layers on patterned substrates2015
Coalesced nanowire structures with interstitial voids and method for manufacturi2015
Group III-nitrides on Si substrates using a nanostructured interlayer2015
Group III-nitrides on Si substrates using a nanostructured interlayer2015
Nanopyramid sized opto-electronic structure and method for manufacturing of same2014
Formation of group III-V material layers on patterned substrates2014
Growth of group III-V material layers by spatially confined epitaxy2014