Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for fabricating flip-attached and underfilled semiconductor devices

Method for fabricating flip-attached and underfilled semiconductor devices

US Patent 8193085 · Granted Jun 5, 2012

Estimated economic value: $6,582,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fan-out semiconductor package2025
Fan-out semiconductor package2023
Fan-out semiconductor package2021
Fan-out semiconductor package2020
Method for fabricating flip-attached and underfilled semiconductor devices2013
Method for fabricating flip-attached and underfilled semiconductor devices2013
Semiconductor device having multiple semiconductor elements2012
IC having TSV arrays with reduced TSV induced stress2012
Method of manufacturing a semiconductor device2011
Semiconductor device with an improved solder joint2011
Semiconductor device with an improved solder joint2010
Method for fabricating flip-attached and underfilled semiconductor devices2010