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Home › System for decharging a wafer or substrate after dechucking from an electrostatic chuck

System for decharging a wafer or substrate after dechucking from an electrostatic chuck

US Patent 8149562 · Granted Apr 3, 2012

Estimated economic value: $8,244,000 ⓘ

Assignee

TSMC

Inventors

Yen-Hsiang Hsu (4 patents)
Jeng-Yann Tsay (7 patents)

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