Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for retention of small components on adhesive backed carrier tape

Method and apparatus for retention of small components on adhesive backed carrier tape

US Patent 8132673 · Granted Mar 13, 2012

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid nozzle for pick and place assembly of very small form factor components2013
Method and apparatus to facilitate retention and removal of components placed on2011
Adhesive backed carrier tape with calibrated levels of low tack adhesion for ret2006
Means to assure ready release of singulated wafer die or integrated circuit chip2002
High speed flip-chip dispensing2001
High speed flip-chip dispensing1999
Tab means to assure ready release of singulated wafer die or integrated circuit 1999
Carrier tape packaging system utilizing a layer of gel for retaining small compo1996
Multiple and split pressure sensitive adhesive stratums for carrier tape packagi1993
Jewelry retaining means including compensation means for dimensional variations 1983