Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

US Patent 8088684 · Granted Jan 3, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus, system, and method for handling aligned wafer pairs2023
System and related techniques for handling aligned substrate pairs2021
Apparatus, system, and method for handling aligned wafer pairs2020
Apparatus and method for semiconductor wafer leveling, force balancing and conta2020
Semiconductor bonding apparatus and related techniques2019
Semiconductor bonding apparatus and related techniques2018
Apparatus and method for aligning and centering wafers2018
Apparatus and method for semiconductor wafer leveling, force balancing and conta2017
Autofocus for imaging system2017
Apparatus, system, and method for handling aligned wafer pairs2017
Microplate stacker for plates with lids2016
Method for thermal-slide debonding of temporary bonded semiconductor wafers2016