Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead plating technique for singulated IC packages

Lead plating technique for singulated IC packages

US Patent 8076181 · Granted Dec 13, 2011

Estimated economic value: $13,101,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertically structured pad system2022
Mechanically-compliant and electrically and thermally conductive leadframes for 2022
Stacked interposer leadframes2014
Stacked interposer leadframes2013
Flexible contactless wire bonding structure and methodology for semiconductor de2012
Enhanced pad design for solder attach devices2012
Pen2011
Flexible contactless wire bonding structure and methodology for semiconductor de2011
Semiconductor device having a suspended isolating interconnect2011
Flashless lead frame with horizontal singulation2008
Flashless lead frame with horizontal singulation2006
Leadframe with support members2004