Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for inserting metal fill in an integrated circuit (“IC”) layout

Method and apparatus for inserting metal fill in an integrated circuit (“IC”) layout

US Patent 8074187 · Granted Dec 6, 2011

Estimated economic value: $5,630,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatus for diagonal route shielding2011
Method and apparatus for inserting metal fill in an integrated circuit (“IC”) la2010
Method and apparatus for inserting metal fill in an integrated circuit (“IC”) la2010
Methods and apparatus for diagonal route shielding2009
Method for local rip-up and reroute of signal paths in an IC design1998
Hierarchial clock distribution system and method1997
Hierarchical clock distribution system and method1996