Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

US Patent 8069726 · Granted Dec 6, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated MEMS electrostatic micro-speaker device and method2025
Constant charge or capacitance for capacitive micro-electrical-mechanical system2025
Drive and sense balanced, semi-coupled 3-axis gyroscope2025
Sensor with integrated heater2024
Fixed-fixed membrane for microelectromechanical system microphone2024
Integrated MEMS micro-speaker device and method2024
Applying a positive feedback voltage to an electromechanical sensor utilizing a 2023
Drive and sense balanced, semi-coupled 3-axis gyroscope2023
Demodulation phase calibration using external input2023
Applying a positive feedback voltage to an electromechanical sensor utilizing a 2022
Demodulation phase calibration using external input2022
Electrode layer partitioning2022