Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer circuit assembly and process for preparing the same

Multi-layer circuit assembly and process for preparing the same

US Patent 8065795 · Granted Nov 29, 2011

Estimated economic value: $41,705,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Curable film-forming compositions containing ortho-hydroxyl aromatic functional 2014
Multi-layer circuit assembly and process for preparing the same2013
Multi-layer circuit assembly and process for preparing the same2013
Coating composition comprising an alkoxysilane, a polysiloxane, and a plurality 2013
Method of forming solid blind vias through the dielectric coating on high densit2013
Printed circuit board with improved via design2012
Method of forming a circuit board with improved via design2012
Method of forming solid blind vias through the dielectric coating on high densit2011
Methods for coating food cans2010
Process of fabricating a circuit board2010
Compositions and methods for coating food cans2010
Method of forming a printed circuit board with improved via design2010