Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Micromechanical component, method for fabrication and use

Micromechanical component, method for fabrication and use

US Patent 8063458 · Granted Nov 22, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with through-substrate via and method of manufacturing a se2024
LED/LD illumination device with separate luminophore configuration, and method f2024
Method of forming a through-substrate via and a semiconductor device comprising 2023
LED module and use of the LED module2022
Semiconductor device with through-substrate via2022
Pressure sensor device and method for forming a pressure sensor device2022
Method for manufacturing an optical sensor and optical sensor2022
Method for manufacturing a semiconductor device and semiconductor device2021
Crack-resistant semiconductor devices2021
Semiconductor device for detection of radiation and method of producing a semico2021
Method of producing an optical sensor at wafer-level and optical sensor2021
Optical package and method of producing an optical package2020