Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Phenolic OH-containing polyimide silicone, epoxy resin and curing agent

Phenolic OH-containing polyimide silicone, epoxy resin and curing agent

US Patent 8053533 · Granted Nov 8, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer processing laminate, temporary adhesive material for wafer processing, and2025
Cleaning solution for temporary adhesive for substrates, substrate cleaning meth2025
Detergent composition, substrate cleaning method, and cleaning method for suppor2024
Photosensitive resin composition, laminate, and pattern forming process2024
Temporary adhesive for wafer processing, wafer laminate and method for producing2024
Photosensitive resin composition, photosensitive dry film, and pattern forming p2022
Photosensitive resin composition, photosensitive dry film, and pattern forming p2022
Method for manufacturing laminate and method for manufacturing substrate2021
Method for producing thin wafer2021
Wafer processing laminate and method for processing wafer2021
Polymer containing silphenylene and polyether structures2021
Method for manufacturing thin substrate2021